The 250W should handle 300W comfortably anyways, so I wouldn't worry. The only major difference I am aware of is that the placement of headers is different than in previous generations of the PSU.
Power Supply HDPlex AC-DC and DC-DC combo
- Thread starter Kmpkt
- Start date
I'll keep my fingers crossed then... if it's the 300 it'll be a nice bonus. As far as I know it hasn't shipped yet, and the site currently only listing the new 300 with estimate ship date of Jan 5 I believe.
I took another look at their site and it lists the 250W DC-ATX as 300W now with a pre-order ship date of Jan 5th.
http://www.hd-plex.com/HDPLEX-300W-Hi-Fi-DC-ATX-Power-Supply-16V-24V-Wide-Range-Voltage-Input.html
EDIT: Sorry, that was already mentioned in the post above
Any idea of the retail price ?
I have the choice between coupling two of these bricks or get a SilverStone SFX SX600-G / Corsair SF600 for 120/130 €.
According to Larry, targeted retail price is $68 !!
EDIT : available beginning of May.
EDIT : available beginning of May.
Last edited:
Placeholder model based off those dimensions: https://smallformfactor.net/forum/resources/hdplex-internal-300w-ac-dc-adapter.71/
The cross-section of the extruded section shows 41mm. That seems to be ignoring the top plate that has the vents though, so to be safe I made the overall height in the placeholder 43.5mm.
Thanks for the model, Aibophobia. I may add details according to the technical drawing and upload it if I have the time and if that's okay with you.
This can help me think ahead of using even more powerful GPUs for my custom case and plan accordingly. Like others have said, I have gripes about the width (62mm) being a bit too large. As it's just 1.5mm less than 63.5mm (2.5 inches) which is the external thickness of the S4 mini case. You'd really have to mod the interior shell with some cutouts to make it fit properly.
This can help me think ahead of using even more powerful GPUs for my custom case and plan accordingly. Like others have said, I have gripes about the width (62mm) being a bit too large. As it's just 1.5mm less than 63.5mm (2.5 inches) which is the external thickness of the S4 mini case. You'd really have to mod the interior shell with some cutouts to make it fit properly.
You can if you want though I'll basically remodel it from scratch once I have one to measure anyway.
If you do decide to add more detail, PM me the model so I can upload it as an update rather than having duplicate entries in the Resources section.
If you do decide to add more detail, PM me the model so I can upload it as an update rather than having duplicate entries in the Resources section.
Alternatively you could just file the cooling fins on the side down until it fits and save your case.
Looking at the detailed spec drawings, the fins add 4mm to either side. You could hypothetically take the unit down to 54mm without compromising the inner structural part of the case. I find myself wondering if you could just place a thermal pad underneath and make up the difference in heat managment by heat sinking the case.
Last edited:
I've already emailed him about this. I'd personally prefer to see the unit ship with a big ol thermal pad with the intention of sinking on whatever case it is in.
As an alternative how would people feel about another 4 mm in height? I would think lengthwise fins over 56mm in width would dissipate approximately the same amount of heat as the two sides.
As an alternative how would people feel about another 4 mm in height? I would think lengthwise fins over 56mm in width would dissipate approximately the same amount of heat as the two sides.
Yeah, that's another option to file down the fins. You'd need about 5mm off from the width to fit inside the chassis interior.
Quick question - we're talking about this unit fitting into the NFC S4 mini as though it is going to be commonly used in that scenario. The only way this has a hope of working in the S4 mini is with a 15cm long or low profile CPU. The only cards at present that fit this definition are 1050ti variants and the R9 Nano. In the case of the 1050ti, one could easily use the 160W version of the AC-DC adapter. With respect to the Nano, 300W is probably marginal for it anyways and the thermals last I checked were just awful in something as constrained as the S4 mini. I know I am the one that sent Larry an email about changing fins around, but in retrospect I just want to make sure we're not bitching and moaning about the size just because we'd like it to be smaller for smallness' sake.
So the official answer is that in the previous iteration of the 250W where they used a simple thin shell around the componentry, heat reached undesirable levels within 30 minutes of stress testing. While the unit is ~92% efficient, that still means it has about 20-30W of heat to dissipate as it approaches full load (which is where most of us intend to use it, let's be honest). Adding the fins has given them adequate dissipation capacity to keep the power supply fully passive. Hopefully this means thermal problems would be even less likely to occur is the unit is actively cooled.
Short answer is the fins are here to stay.
Short answer is the fins are here to stay.
