Well the solid outer panel is still there, so it's not like that benefit would go down the drain, you just lose it if you choose a different material for the outer panels.
It sounds like I'm falling into the trap of feature-creep, but all of these things were options that I wanted to explore in one way or another and now have concrete ideas for. I'm getting ever so closer to my goal of making a uSFF case that is extremely easy to build in.
Also, I'm spending a lot of time reorganising my CAD assemblies.
Modular I/O section that allows the user to either choose from pre-determined I/O options and panels or make custom I/O panels themselves
You may have to be careful there, I believe these guys have a patent on modular front IO: http://www.frontx.com/
Any tips on this? I'm starting to run into this issue.
You may have to be careful there, I believe these guys have a patent on modular front IO: http://www.frontx.com/
It says:
WORLDWIDE PATENT PENDING
The product is pending International Patent.
And then:
Copyright © 2000-2014 . Frontx CPX Sdn Bhd
How long ago did they submit for a patent? Was it not awarded? My searches for Frontx and CPX Computer Port Extension did not return anything...although it wouldn't if the patent was filed but still pending.
However, I think there are probably many work-arounds to whatever patent they are getting. I would imagine it may be limited to the stacking of the individual I/O ports. I/O has been adjustable through 5.25" & 3.5" bays, PCI brackets, and front panel brackets for CompactPCI, VME, VXS, VPX, and other embedded applications for a long time now. There are also modular I/O solutions for server racks, as well.
So, if your solution is all of the I/O individually attaching or a singular grouping of I/O attached together (e.g. on a bracket), as opposed to a plurality of separate I/O ports attached together, I think you'll be in the clear.
Now we know the hard battles a passionate case designer has to fight