Hi guys,
I'm going to be running preorder special on these Beef cake back plates for those who are interested. They will be 20% off until the end of January, when product would ship. See the link for more information.
Gauging interest in a new product.
There has been a lot of discussion on the web regarding processor bending and the issues it can cause on the LGA-1700 socket. I believe the issue has been determined to be that the socket rear plate is not rigid enough for the socket retention force due to the higher pin count on the CPU. This can cause motherboard, socket and CPU bending, all of which can lead to decreased component lifespans. My idea to alleviate said issue would be to machine a socket rear plate and CPU thermal solution mounting plate from a single piece of steel. The new back plate would replace the flimsy stock socket back plate with a plate that is twice as thick. This is similar to how AMD doses their back plates, one piece for socket support and thermal solution mounting. I believe this would be a massive improvement in socket rigidity and could alleviate any bending of the motherboard and socket and possibly improve thermal performance. This design essentially eliminates any motherboard loading. Please let me know your thoughts.
New improved on the left, and the stock on the right.
Thickness comparison
Stock back plate
Modultra Beefcake back plate
I'm going to be running preorder special on these Beef cake back plates for those who are interested. They will be 20% off until the end of January, when product would ship. See the link for more information.
Modultra Beefcake back plate.
. The Modultra Beefcake back plate is a rear mounting contact frame for your intel LGA 1700 socket mother board that replaces the weak and flexible stock LGA socket back plate. The beefcake was designed to eliminate any ILM induced bending to your CPU and motherboard. In addition the Beefcake...
modultra.com
Gauging interest in a new product.
There has been a lot of discussion on the web regarding processor bending and the issues it can cause on the LGA-1700 socket. I believe the issue has been determined to be that the socket rear plate is not rigid enough for the socket retention force due to the higher pin count on the CPU. This can cause motherboard, socket and CPU bending, all of which can lead to decreased component lifespans. My idea to alleviate said issue would be to machine a socket rear plate and CPU thermal solution mounting plate from a single piece of steel. The new back plate would replace the flimsy stock socket back plate with a plate that is twice as thick. This is similar to how AMD doses their back plates, one piece for socket support and thermal solution mounting. I believe this would be a massive improvement in socket rigidity and could alleviate any bending of the motherboard and socket and possibly improve thermal performance. This design essentially eliminates any motherboard loading. Please let me know your thoughts.
New improved on the left, and the stock on the right.
Thickness comparison
Stock back plate
Modultra Beefcake back plate
Last edited: