Moving to production phase
Time is limited and there are many opinions to consider. We have been evaluating the last major change for a couple of days now, the wider Core has been produced (from laser cut Plexiglas and 3D prints) and tested.
The major benefits are the following:
· Better CPU cooling compatibility
· Easier build and increased cable management space in the center of the case
· The top grill now has a perfect hole pattern with even margins to each side
· PSU-bracket now fits inside of cooling deck instead of underneath it – allowing us to move the PSU-bracket up in the hanging orientation and making the SFX-L work better in hanging orientation.
· Opens for ODD solution in TopHats
The main cons are the following:
· Larger total case volume, increased by 4%
· More dead space when using TopHats
· Larger footprint
The decision is to go for the wider design. Some will be disappointed, hopefully this decision satisfies most of you.
IO-panel question has been decided to go for 2 * USB type-A 3.1 gen 1 in the standard solution.
We will not be able to satisfy everyone’s preferences with this one product; some compromises are needed for the product to reach the market and we can’t stay in the design phase much longer. We are convinced that the product holds a strong value proposition and embodies the best blend of innovation, performance, design, flexibility and miniaturization currently out there.
We are about to move to the Sample and Tooling phase where most of our efforts will be spent the coming weeks to ensure the Ghost becomes reality. A re-launch take place as soon as we are through these two phases – the plan is intact where the re launch will take place during the summer with deliveries to the first buyers Oct-Nov. If it’ll be through crowdfunding or not is still to be decided.