They've also been working on this for at least a year-probably more. The first Kickstarter came out in April of last year and they've been refining it ever since then. That's not to say that more improvements couldn't be made, but they've had several prototypes made and have sent some of those to reviewers to get their opinion.
Prototype The world most flexible SFF case? LOUQE Ghost S1
- Thread starter PaChalski
- Start date
Thanks for the thorough and logical explanation, covering core count, TIM vs soldering, and motherboards automatically overclocking (Multi Core Enhancement, and turbo up to 130w) my 6700K and 8700K. Both with Asus motherboards: Strix Z270i and Strix Z370i respectively.
From my experience, I had a harder time taming the 8700K vs the 6700K. Both 95w TDP. You can see why I’m skeptical to the new claims of 95w TDP for the 9900K. Having said all that, I’m still getting the 9900K when it comes out as I am still running CPU based renderings, and higher core count scales so nicely for my work.
You can always undervolt and lower the target TDP to suit, but I just strongly feel that Intel pushed their luck with the aggressive all-core turbo they are targeting is all.
My problem is this. They cannot go to where they have gone compared to other Skylake-based cores without increasing voltage and power to meet the increased demands of the added cores and increased frequency. As it is, Coffee Lake with stock can only reach 4.3 GHz for all-core turbo across six cores.
Given this, I would have naturally understood them dropping down the all-core turbo by a couple hundred megahertz for the added cores. Or even in a more idealistic scenario, they could push for more cores at the same all-core turbo, though this is less likely.
But adding more cores at a far higher all-core turbo across eight cores means even more power no matter how many ways you try cutting it.
Furthermore every CPU is different even on the same voltage. If you buy 10 x 8700k some chips will generate more heat and some less. It depens on wafer quality, silicon quality and factory heatspreader attachment.
I dont think so. If You open the Heatsink PDF, there is a picture with a 25mm thick fan and a SFX(not L) psu and there is barely any space for cables.
Exciting that you guys are receiving your cases soon... I'll periodically keep refreshing the LOQUE page, looking for an option to buy.
Over the last few weeks I've been doing my youtube and forum research on my next build. (Current machine is an air cooled i2500K with a 980 GTX TI, originally built in Jan, 2011 inside a micro-atx Silverstone FT03.)
Thinking of doing an air-cooled GTX1080TI intel 9th generation build with either a DAN A4-SFX case or LOUQE case. Any thoughts of which 1080 GTX TI I should be hunting for? The build will be used for gaming (1440P) and video work. I'm cool with going the AMD route as well. Any thoughts? (I'd like to go with air cooling as I plan to be flying a fair amount with it as carry on.) Are any of you planning on doing an air-cooled system? What's the plan? If you are going the air-cooled route, what sized top hat are you planning on buying to accommodate your hardware?
Cheers,
Over the last few weeks I've been doing my youtube and forum research on my next build. (Current machine is an air cooled i2500K with a 980 GTX TI, originally built in Jan, 2011 inside a micro-atx Silverstone FT03.)
Thinking of doing an air-cooled GTX1080TI intel 9th generation build with either a DAN A4-SFX case or LOUQE case. Any thoughts of which 1080 GTX TI I should be hunting for? The build will be used for gaming (1440P) and video work. I'm cool with going the AMD route as well. Any thoughts? (I'd like to go with air cooling as I plan to be flying a fair amount with it as carry on.) Are any of you planning on doing an air-cooled system? What's the plan? If you are going the air-cooled route, what sized top hat are you planning on buying to accommodate your hardware?
Cheers,
By the way, I emailed TSA about flying with a closed loop water cooler and received this response:
"After reviewing your inquiry, the item in question is generally permitted in carry-on or checked baggage"
I think it is fine so long as it is sealed within the system. Now I have yet to actually try to fly with it so in reality it may play out quite differently but at least officially they are allowed.
Hey Howdy,
Thanks for the information, however:
When flying, have you thought about pressure changes causing issues with a closed loop water cooler?
Oh yes, good point. I see that now in the first picture. Thanks for pointing that out!
those pictures were taken before they added the extra mounting holes for the psu
No problem! I have looked around and seems the consensus online is that it won't be a problem in any pressurized cabin. Wish I could find some information to back that up. I believe the thinking is that the pressure changes are not extreme within the cabin and that coolers probably need to be shipped by airplane at some point and are designed to withstand pressure changes while shipping.
Considering that they are still packaging and that shipping will take 3 weeks i suppose that we can expect the case for early october at best.
bottom fan won't do much given the smal gap between the case and the surface its sitting on. I would just skip having one.
They will ship them in uk, go through customs and then to us.
They were the one to say that it would have taken 3 weeks.
Btw thinking that 48h are enough to ship a case from taiwan to your door is pure madness
Only cases going to the EU are going to the UK Warehouse. This adds time to their shipping, but I think 48hr air shipping is still viable to US customers.
