Hi SFF Forum,
I recently bought a used 8700k that was delidded and lapped. Before shipping, he re-opened the CPU and reapplied the liquid metal and silicon glue. When I received it today, I noticed it had quite a bit of excess silicon glue as a result from squeezing the cpu + IHS. Is this considered excess and could it potentially cause a problem? I can fit a folded paper between the gap (~0.1mm) but not triple folded (0.15mm?) IIRC a big factor of decreasing temperature from delidding is from decreasing the distance between the IHS and CPU. One way to do that is through using thin TIM like liquid metal as opposed to Intel's thick TIM. The other, using a thin glue or none at all?
The previous owner claimed an overclock of 5.1 GHz at 1.38V with a temp of 65C on his H100i v2 (probably in an ATX case). A mITX and U9S user on pcpartpicker with a 5.2GHz OC got 68C under gaming and low-mid 70 under synthetic bench so I will probably use that as comparison when I report back on Friday when I get my motherboard.
I recently bought a used 8700k that was delidded and lapped. Before shipping, he re-opened the CPU and reapplied the liquid metal and silicon glue. When I received it today, I noticed it had quite a bit of excess silicon glue as a result from squeezing the cpu + IHS. Is this considered excess and could it potentially cause a problem? I can fit a folded paper between the gap (~0.1mm) but not triple folded (0.15mm?) IIRC a big factor of decreasing temperature from delidding is from decreasing the distance between the IHS and CPU. One way to do that is through using thin TIM like liquid metal as opposed to Intel's thick TIM. The other, using a thin glue or none at all?
The previous owner claimed an overclock of 5.1 GHz at 1.38V with a temp of 65C on his H100i v2 (probably in an ATX case). A mITX and U9S user on pcpartpicker with a 5.2GHz OC got 68C under gaming and low-mid 70 under synthetic bench so I will probably use that as comparison when I report back on Friday when I get my motherboard.
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