This is a gray accessory of Z13, you can refer to it, MQ5 gray will be the same as Z13.Any idea how the grey will look like irl? Comparable to space grey from Apple?
Thanks for the compliment, I'm about to post a thread on MQ6.Really love the design! Looks very sleek and clean aesthetically! Looking forwards to the thread for the larger model too
Was it because of that?In fact, the top fan vents outward. I installed it backwards
Thank you so much for your love of it!What a case, a real work of art!
Everything looks perfect, except maybe for the thermals.
10 minutes of stress testing is not that much and the temps already went high, especially for the CPU.
Was it because of that?
And thanks to the relevant remarks of @tinyitx and your inventiveness, cooling should now be improved with the PSU fan as intake and the heat shield addition.
Providing a temperature test is already nice, but maybe you could update it to demonstrate how the three changes above have impacted it?
Even if it's probably unneeded and too late depending on how far you are already in the production process, I could not resist to try modding the case so that a second fan can be added on top.
From what I see there is enough room for two top fans, some row of holes could even be added without compromising the structure of the case I guess.
The only issue I see is one of the motherboard support being in the way.
And to have the two fans draw more air from the case itself and not from outside, I would remove some holes on the top of the side panels.
Thank you very much for your advice, this issue after my careful consideration, I still decided to keep the current design without adjustment.I'll add to this thread as well.... I think the rear PCIE opening should be one larger opening instead of 2 smaller slits. My 2070 ITX exhausts a lot of hot air out the back, with the fins oriented front to back. Having a metal piece dividing the opening will hurt airflow.
I want the MQ6, but I don't want my thermals to regress. My current case has just 1 large opening; the center pillar will block 1/2 of the vent area.
edit: Another way to improve thermals is to increase exhaust at the top. There is still a lot of metal with the holes placed where they are. Perhaps just increasing the diameter of the holes already there, instead of adding more holes, would keep costs the same.
@ COOJ I still love the design, I'm just giving some feedback.
Thank you for your detailed response and considerations. With everything that you've said, I can see the need to keep the current design.Thank you very much for your advice, this issue after my careful consideration, I still decided to keep the current design without adjustment.
The first reason is that there are now many people have booked these two cases, I can no longer arbitrarily modify the design.
The second reason is that some people only need a slot for the PCIE, such as someone in the PCIE position to insert a network card to use the MQ5 as a router, when the PCIE if a large opening will be very ugly.
The third reason is my personal aesthetic preference for the current design.
Regarding the top heat sink, the current density and diameter is a balance between design aesthetics and thermal performance, in fact my design is not for extreme performance considerations, I need to make it look visually harmonious.
Isn't that why you like it?
I have prepared two options with PSU.All are modified versions of the module.Thank you for your detailed response and considerations. With everything that you've said, I can see the need to keep the current design.
And yes, I do love the looks of this case.
You mentioned the ability to pair this with a riser and PSU. Do you know what models? Will it be the modified Enhance 7660B in your original post?
Production will begin when the total number of units reaches 50, regardless of whether you order through my website or through a reseller on Taobao.Are orders through your website going to make it for the first batch? Or will you start production as soon as you hit 50 units (through taobao)?
Thank you so much for supporting my work~Already Ordered a MQ5. Hope to get my hands on it in a few months.
The HDPlex DC-ATX + DC-AC combination is not standardized, so this requires you to figure out how to mount it yourself, usually with double-sided tape in the original FLEX location.Have you figured out how to mount HDPlex DC-ATX + DC-AC combo yet? That's the only thing holding me back (though just a little bit)
Looks like it should fit perfectly, as long as there is a 55mm gap between the bottom of the case and the gpu. I wouldn't count on that gap being 55mm though. Measuring my 3070 FE in my T1, i'm getting slightly below that 55mm. Likely it will be highly dependent on the gpu size.Also, if using the HDplex Dc-ATX + AC-DC combo from HDPlex, it might be possible to mount the DC-ATX vertical, on the motherboard side where the FlexPSU would be. And the 180 mm long AC-DC unit horizontally, below the GPU? Where the extension cable for the psu is now.
Any chance you could take measurements on the available space below the GPU side, Cooj? Because if that works, it would mean the GPU in the MQ5 could also extend the full 219 mm. Like in the MQ6.
I've been busy with the Z13 shoot lately, so I'm sorry I'm a little late in replying to you.Also, if using the HDplex Dc-ATX + AC-DC combo from HDPlex, it might be possible to mount the DC-ATX vertical, on the motherboard side where the FlexPSU would be. And the 180 mm long AC-DC unit horizontally, below the GPU? Where the extension cable for the psu is now.
Any chance you could take measurements on the available space below the GPU side, Cooj? Because if that works, it would mean the GPU in the MQ5 could also extend the full 219 mm. Like in the MQ6.