This will depend very much on the tooling and production costs to make the swappable baseplates for TR4/2066 as well as the provision of compatible mounting hardware for these socket being already manufactured by my manufacturer of choice. Tooling costs and production volumes for the entire TR4/2066 baseplate and mounting solution will likely be prohibitive initially, but if I only have to pay for copper baseplate tooling then it may be manageable.
My primary uses for the heatsink (ie. the reason I made it in the first place) are 1151/AM4 and MXM. Because the MXM unit can (likely) use the same baseplate as the 1151/AM4 heatsink, merely repositioned, I am hopeful that all I will need to do to make this model work is design a modified mounting kit. 2066/TR4 will obviously require a much larger baseplate and beefier mounting to be as fully effective as possible.