Keenly, and patiently, hoping this all turns out well for you, KMPKT! (And for us too! hehe)
Honestly it's so much more complicated than that, but I'll try to break it down.
Within any given heatsink there are like 10 possible rate limiters to heat dissipation, but overall conductance is king. There are people that say aluminum moves heat to air more effectively than copper despite the fact that it's conductance is literally half that of copper. My guy with a PhD in thermal engineering straightened that one out for me - it's complete bullshit. As far as heatsink design goes, the reason that aluminum is as good as copper for a lot of heatsink designs comes down to the fact that you can't get enough heat to the fin stack through the various heat transfer barriers to take advantage of copper's superiority.
Take a 6mm heat pipe as an example. By numbers, a single 6mm heat pipe can transmit 38W of heat if completely straight. If you put a couple of bends into it to recurve back to the fin stack (like the L9i as an example) you've already reduced that to 33W. That means on an L9i you have 66W of heat that can be dissipated through the pipes with the rest of the capacity coming by way of the fact that Noctua has used a long heatsink base to allow for superior connectivity from base to fin.
Taking this design further, you have to also understand all of the resistance barriers that exist between the IHS and the fins. Again using the L9i as an example:
With all of this in mind, the ways I will be taking advantage of this in my heatsink involve creating approximately two to three times the contact surface between fin and base, increasing the contact surface between pipes and the base, increasing the contact surface between the fins and the pipes by a factor of 2-3, improving airflow characteristics significantly, as well as allowing for the use of a greater variety of thermal compounds.
- IHS to Copper heatsink base - this is somewhat aided if using a reasonably good thermal paste but is a large barrier nonetheless
- Copper heatsink base to heat pipes - there will possibly be some thermal paste here, but this is another significant barrier. A heat pipe can't conduct 33W of heat per pipe if the heat cannot effectively enter the pipe
- Copper heatsink to fin - On the rare occasion that the fins actually communicate with the base like in the L9i (this is the only reason it's so far ahead of other two pipe coolers) this is a solder joint. Because the solder used is specifically thermally conductive, this is a relatively low barrier to heat transfer
- Heat pipe to fin - this is another solder joint and therefore transfers heat relatively well
- Fin to air - IF you have enough heat reaching the fins to actually max out your stack (very unlikely given conventional designs) then this is where copper fins can vastly outstrip aluminum. To put this in perspective, when doing early simulation of my heatsink design I was able to put one fin every 2.0mm in copper instead of 1.2mm with aluminum and achieve similar thermals. This reflects a near 2/3 improvement in heat dissipation with effective design.
- Airflow properties - once you're at the point where you're transferring heat from fin to air you have to consider airspeed (CFM), turbulence within the stack, air redirection, stagnation of air if it isn't redirected properly, balancing of air pressure across the fin stack, variability in airspeed between the inside and outside of the fan impeller, etc.
Honestly it's so much more complicated than that, but I'll try to break it down.
Within any given heatsink there are like 10 possible rate limiters to heat dissipation, but overall conductance is king. There are people that say aluminum moves heat to air more effectively than copper despite the fact that it's conductance is literally half that of copper. My guy with a PhD in thermal engineering straightened that one out for me - it's complete bullshit. As far as heatsink design goes, the reason that aluminum is as good as copper for a lot of heatsink designs comes down to the fact that you can't get enough heat to the fin stack through the various heat transfer barriers to take advantage of copper's superiority.
Take a 6mm heat pipe as an example. By numbers, a single 6mm heat pipe can transmit 38W of heat if completely straight. If you put a couple of bends into it to recurve back to the fin stack (like the L9i as an example) you've already reduced that to 33W. That means on an L9i you have 66W of heat that can be dissipated through the pipes with the rest of the capacity coming by way of the fact that Noctua has used a long heatsink base to allow for superior connectivity from base to fin.
Taking this design further, you have to also understand all of the resistance barriers that exist between the IHS and the fins. Again using the L9i as an example:
With all of this in mind, the ways I will be taking advantage of this in my heatsink involve creating approximately two to three times the contact surface between fin and base, increasing the contact surface between pipes and the base, increasing the contact surface between the fins and the pipes by a factor of 2-3, improving airflow characteristics significantly, as well as allowing for the use of a greater variety of thermal compounds.
- IHS to Copper heatsink base - this is somewhat aided if using a reasonably good thermal paste but is a large barrier nonetheless
- Copper heatsink base to heat pipes - there will possibly be some thermal paste here, but this is another significant barrier. A heat pipe can't conduct 33W of heat per pipe if the heat cannot effectively enter the pipe
- Copper heatsink to fin - On the rare occasion that the fins actually communicate with the base like in the L9i (this is the only reason it's so far ahead of other two pipe coolers) this is a solder joint. Because the solder used is specifically thermally conductive, this is a relatively low barrier to heat transfer
- Heat pipe to fin - this is another solder joint and therefore transfers heat relatively well
- Fin to air - IF you have enough heat reaching the fins to actually max out your stack (very unlikely given conventional designs) then this is where copper fins can vastly outstrip aluminum. To put this in perspective, when doing early simulation of my heatsink design I was able to put one fin every 2.0mm in copper instead of 1.2mm with aluminum and achieve similar thermals. This reflects a near 2/3 improvement in heat dissipation with effective design.
- Airflow properties - once you're at the point where you're transferring heat from fin to air you have to consider airspeed (CFM), turbulence within the stack, air redirection, stagnation of air if it isn't redirected properly, balancing of air pressure across the fin stack, variability in airspeed between the inside and outside of the fan impeller, etc.
You have said that you are patenting your product. FWIW I invented a product a few years ago and filed a patent for it. The time period for filing in various countries just ended this year. Though I have no legal training whatsoever I wrote all the legal stuff myself, i.e. the Specifications and Claims after reading a book on how to do it. In so doing I saved a lot of money. If you need any advice regarding the documentation I can point you in a self-learning direction.
However the fact is, after having gone through the process, I now no longer believe it is a good idea to patent. Sadly I find that it is a sort of 'protectionism' and a means by which technology and advancement can be slowed down unfairly.
I am using a patent lawyer I have used in the past for other inventions I have in the field of medicine. I appreciate the offer though
I respectfully disagree with your viewpoint here, but I do appreciate where you are coming from especially considering how patents are typically used by large rent-seeking corporations.
The obvious reason for obtaining a patent is that I have a significant amount of time and money invested in bringing this product to market. I do not think it unreasonable to use a patent to ensure that I have a fair chance to both recover my investment and make a reasonable profit without large corporate interference. I am convinced that not filing patents would simply open the door to a larger entity taking my idea and getting it to market at a volume and price that I could never hope to compete with. Any brand power I may have lives and dies on these message boards and is certainly not enough to leverage a dominant market position from.
To add some perspective and rationale, this exact scenario played out for a close friend of mine not long ago. Unbeknownst to him, a large Taiwanese conglomerate discovered his product development (after he had filed a provisional patent on the invention in question), filed their own patent on the invention (which would have eventually been invalidated due to first to file laws), and then proceeded to serve him with a litany of legal action including cease and desist notices claiming their patent filing. Although the rightful owner of the IP in question, the long, drawn out and cripplingly expensive process of proving that he had patent priority meant he was unable to fund a defence against the legal action. This ultimately led him to completely abandon the manufacture and sale of his passion project. This also left him unable to recoup the development and manufacturing costs on his project resulting in a significant financial loss.
Ultimately my goal in holding intellectual property rights on my inventions is that I can choose to litigate large corporations who are pirating my ideas in an attempt to outcompete me using the scale and efficiencies they alone possess. Also, I am fortunately in the position where I believe I could successfully defend myself in the situation outlined above (but would obviously prefer not to).
With all of that being said, the same power conferred by a patent means that I can consciously choose to leave other small innovators alone which is what I would most likely do. Beyond that, I could even use the profits of my IP combined with free licensure to provide them with the tools to expedite innovation. As a working example of this, Joshua Sniffen of Not From Concentrate holds a utility patent on his Skyslots. He spent a large amount of time getting this panel venting system properly designed by engineers to allow for maximum airflow in small form factor PCs. I believe his intent with his IP is to make large corporations license his technology for fair profit while allowing community members like CustomMod to use his features freely for small scale production by simply asking.
Anyhow, it is my strongly held belief that leaving your IP unprotected is simply an invitation for big players to steal your ideas and leverage them back against you. Allowing this to occur in no way fosters innovation, but instead acts to financially strangle out those who possess true innovative potential due to their inability to compete financially. Furthermore, having attended Computex last year, I can tell you that there is precious little innovation happening in the PC space right now. Anything a large corporation could use to outcompete their contemporaries is fair game to be lifted.
Ultimately, I believe your view on patents centres around non-benevolent use of said patents (ie. greed driven). I can assure you that my desire to obtain patents is driven by a desire to keep less altruistic entities from doing exactly this while allowing me to use my IP to help other small innovators to move forward and be competitive with the protection of my own patents. To take that one step further, it is actually my long term intention to weaponize any innovations I have against large and non-innovative entities allowing more opportunities for the underdogs.
Thaaaaaaaaaat's it, I'm committing to a particular Asrock board nowI'm planning on making it TR4/X299 compatible if real life performance matches simulations
Thank you for highlighting your views. I do respect them! I merely offer my very subjective perspective. But practically speaking, should a copy emerge from Taiwan or China (your primary threats I think) how do you hope to defend against it? As I understand even in Taiwan such legal protection is only in word and not deed! Would not all the investment have been in vain?
Many people are willing to pay for quality craftsmanship, peace of mind, and expert support. One quick question: will this heatsink perform well if I use a fan in a upward draft/outward pressure configuration? For my RVZ02, I have noticed that my temps are far better (about 5-10 degrees Celsius lower) with the CPU fan facing up and out rather than down and in on any of my AM4 heatsinks (stock Wraith Spire and ID-COOLING IS-60).By going that far downmarket, they're not taking my customers anyways (someone only willing to pay 29.99 for a heatsink is outside my target client base). As a brand my goal is to stay as premium and uncompromising as possible.