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Prebuilt [SFFn] ASRock's DeskMini A300 - Finally!
- Thread starter confusis
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I see, A300 supports even higher clocked RAM (3400+)
So i could use even two of these?:
- G.Skill RipJaws SO-DIMM Kit 32GB, DDR4-3800, CL18-18-18-38 (F4-3800C18Q-32GRS)
- Corsair Vengeance SO-DIMM Kit 32GB, DDR4-4000, CL19-23-23-45 (CMSX32GX4M4X4000C19)
Is it true RAM is still faster when the memory clock speed is higher even when Latency-values are worse (e.g. CL19-23-23-45)?
e.g. see nanoseconds values: CL16 (3000) is slower than CL19 (4000MHz)
| VALUE | DDR4-4000 | DDR4-3800 | DDR4-3000 |
|---|---|---|---|
| CAS Latency CL | 19 (~9.50ns) | 18 (~9.47ns) | 16 (~10.67ns) |
| Row-to-Column Delay tRCD | 23 (~11.50ns) | 18 (~9.47ns) | 18 (~12.00ns) |
| Row Precharge Time tRP | 23 (~11.50ns) | 18 (~9.47ns) | 18 (~12.00ns) |
| Active-to-Precharge Time tRAS | 45 (~22.50ns) | 38 (~20.00ns) | 36 (~24.00ns) |
?
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You could use 2 of the modules from the 4 module kits, but the limit would be the memory controller (IMC) in the CPU. Zen / Zen+ (2000 Series APU / 3000 Series APU) will top out earlier. My understanding is somewhere around 3466 MHz is the typical stable limit the the IMC for those processor cores, that would be no different on the Deskmini. So little gain from the kits rated 3800+. This may change if Zen 2 based APUs were to become available (Renoir), the Zen 2 IMC can drive much higher clockspeed.
As for speed vs latency, with the APUs, it appears speed almost always wins over latency.
my 3400g runs 3600c16 easily, tested on 2 different b450 motherboards and with 2 diff ram kits as well. i'm so tempted to grab the corsair 32gb 3600c16 sodimm kit and sell the 2 sticks i don't need. then i could actually get decent performance out of this a300, assuming they update to ABBA or 1.0.0.4 eventually
When it comes to ram, heat, stability...
The A300 has been great, but running anything past ddr-3333 for long periods would crash the system under heavy loads and heat. I was hoping for a BIOS update but...
I've been running BOINC non-stop for a few months and had to turn the max utilization of resources down to 80% - the A300 isn't meant for long term data crunching. The whole system turns into a giant space heater. The NH-L9A can't keep up... I was thinking about making a shroud so the machine only sucks in cool air but haven't gotten to it yet. Setting the device upright so the A300 could suck air in the side and blow it out the top was helpful.
Still a great little machine. Perfect for my needs, was fun to play with. Heat is causing long term stability though. I'm sure BOINC wasn't the intended use case, but if it's just sitting idle why not contribute to science?
Anyone try getting a NF-A4X10 (or X20) to fit in the case? Would like to put the exstra fan header to good use.
The A300 has been great, but running anything past ddr-3333 for long periods would crash the system under heavy loads and heat. I was hoping for a BIOS update but...
I've been running BOINC non-stop for a few months and had to turn the max utilization of resources down to 80% - the A300 isn't meant for long term data crunching. The whole system turns into a giant space heater. The NH-L9A can't keep up... I was thinking about making a shroud so the machine only sucks in cool air but haven't gotten to it yet. Setting the device upright so the A300 could suck air in the side and blow it out the top was helpful.
Still a great little machine. Perfect for my needs, was fun to play with. Heat is causing long term stability though. I'm sure BOINC wasn't the intended use case, but if it's just sitting idle why not contribute to science?
Anyone try getting a NF-A4X10 (or X20) to fit in the case? Would like to put the exstra fan header to good use.
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I do think a shroud would help. With the Wraith it's not needed because it sits so close to the vent. Heat/overvoltage issues should be resolved if they ever release the 1.0.0.4 bios
I'm sure a LOT of our issues can be resolved with a BIOS update but I don't think ASRock is making it a priority. I've tried to reach out a few times and they believe everything is fine. Most people who purchase the A300 aren't trying to squeeze every last drop of performance out of it
Been patiently waiting for BIOS 3.6 for a while. HOPEFULLY we don't have to wait for the next APU...
If the sight of it doesn't bother you, you could just have a barrel plug coming out of the back of the case, plugging into the power entry plug, from your internal PSU. Otherwise desoldering is what you'll need to do, it is possible though I'm not sure anyone here as reported doing it.
Curiosity
Too busy figuring out if I can to think if I shoul
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I had no issues using my 1060 over an m.2 to pciex4 riser.
What do you mean it's super laggy? Just to be sure, you aren't plugging into the mobo outputs when using the 570, are you? (I imagine not, but have to check)
Also, personally, my plan for going brick less with my a300 once I've got the case figured out is to have the 'front' IO be the rear IO, similar to how it was done in the stx 160.
What do you mean it's super laggy? Just to be sure, you aren't plugging into the mobo outputs when using the 570, are you? (I imagine not, but have to check)
Also, personally, my plan for going brick less with my a300 once I've got the case figured out is to have the 'front' IO be the rear IO, similar to how it was done in the stx 160.
The 3.51 BIOS? I don't think that is a Combo-AM41.0.0.3 BIOS but a Combo-AM4 1.0.0.1 BIOS, like 3.50. It only introduces some fix for issues with Hyper-V under 3.50 from what I read and people have gotten it from ASROCK support directly if faced with those issues. Haven't tried it though.
Everything Combo-AM4 1.0.0.3 and above generally appears only recommended for Matisse (Zen2). Are there any reports on Picasso (Zen+) seeing any benefits?
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No but actually you were right. I just updated to it, BIOS L3.51 is AGESA Combo-AM4 1.0.0.3, not 1.0.0.1 as I had wrongly assumed before. This can be confirmed from the AMD firmware version submenu somewhere in the AMD CBS menu in UEFI. It does contain an updated ABL and an updated processor ucode patch, compared to P3.50. SMU firmware appears to be the same as P3.50. It performed at best the same for me as P3.50, which in turn performs worse than P1.20 for my 2000 Series APUs. YMMV for a 3000 series APU. Personally, I have reverted to P1.20.
What I like about this, if ASROCK is, at least on limited release, following AMD AGESA releases with the A300, Renoir support should not be out of question
I am amazed by the thought hat maxing out such a small and densely packed device is a worthwhile idea. In an STX case you have a single cooler fan that blows the CPU heat onto the rest of the tiny board, where those neighbouring components already struggle to stay cool themselves since they all heat each other by sheer proximity and by the easy to heat up small mass of the mainboard itself. Thus, heat sensitive and already hot NVMe SSDs are kept closer to their own throttling temps, so have little room to perform themselves. Component degradation by heat is accelerated in such an STX oven. It may keep your coffee warm but it looks like the wrong choice for performance junkies.
Personally, I like my STX to stay almost inaudible most of the time
Personally, I like my STX to stay almost inaudible most of the time
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For me it's not about getting ultimate performance, it's about the challenge of pushing performance in the smallest package I can
Here are some CPU cooler clearance tests with the A300: http://blog.livedoor.jp/wisteriear/archives/1073654956.html (Google Translate did a good job translating it for me). I'd be cool to fit a C7 Cu into the case; did anyone try modding it yet?
I have an A300 with a 3200G on the way. I'm going to use it as a headless server running 24/7, but it'll be close to idling most of the time (running Nextcloud and file sharing services). It's going to live close to my bed, so silence is an important factor. From what I read, it's possible to idle the whole machine under 10 W without much trouble, so I don't think heat and noise is going to be much of an issue - but the bigger the heatsink, the better.
I have an A300 with a 3200G on the way. I'm going to use it as a headless server running 24/7, but it'll be close to idling most of the time (running Nextcloud and file sharing services). It's going to live close to my bed, so silence is an important factor. From what I read, it's possible to idle the whole machine under 10 W without much trouble, so I don't think heat and noise is going to be much of an issue - but the bigger the heatsink, the better.
I have an Intel STX board (started with Asrock but now on Asus H110S1/CSM) , but regarding the similar Noctua L9 fan , I recomend keeping a constant rpm up to some threshold. At constant 800 rpm, it is almost inaudible, even up to constant 1000 rpm, its is very silent. Higher oder varying rpms OTOH, are audible.... It's going to live close to my bed, so silence is an important factor. From what I read, it's possible to idle the whole machine under 10 W without much trouble, so I don't think heat and noise is going to be much of an issue - but the bigger the heatsink, the better.
It would be interesting to know, if a larger fan with lower rpm is actualilly even more silent or not.
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