They are confirmed from
EVGATech_LeeM who is the EVGA Moderatory on their forums at
Thanks for the link
Thickness of the 3090/3080 XC3 models with backplate (XC3 Ultra/XC3) is 1.78in. - 45.1mm.
Thickness of the 3090/3080 XC3 models without backplate (XC3 Black) is 1.61in. - 40.9mm.
So essentially it looks like this:
From top of PCB at the back of the card to perforation down below there is 48 mm of space.
From top of the PCI bracket at the back of the card to perforation down below there is 49 mm of space (bracket is bent around and screwed at the back of the card usually).
From the top of assumed cooler retention screws at the back of PCB or a backplate that is offset by 5 mm from the PCB, there is 53 mm of distance to perforation.
The physical quadro card that I have on my hands to check things out, that has backplate offset by 3 mm, is 40 mm thick.
It seems like the backplate is adding 4.2 mm of thickness to those cards, but at the same time it looks like it's 5 mm offset from the surface of the PCB and the PCI bracket is something like 0.8 mm thick.
It looks like there will be 8 mm of space between the card and perforation so it should be okay in Sentry 2.0 (considering the potential noise caused by fans being too close to perforation, not the 320W TDP).
They are stating 2.2 slot thickness though because you can't put two of those cards next to each other since in reference design the front should hide a little behind the PCI bracket (or it's reference width, a single slot is 20.35 mm wide) if you want to squeeze in the second card's backplate or even cooler retention screws sticking out at 3~5 mm from the PCB.
