SFF.Network Innodisk booth at Computex 2017
- Thread starter jeshikat
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Agreed, I loved my kit of ballistix and it worked great with my U9S, I just think everything about this new generation is about big and bulky. Like 3 slot GPUs, motherboards covered in plastic shrouds, CPU coolers with plastic cases and memory with 60mm heatsinks.
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Ionrent
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To add a bit, Samsung B-Die is definitely the way to go right now for either AMD or Intel based systems. Nearly all the 24/7 stable memory overclocks on OCN use G.Skill kits with Samsung B-Die chips. The crazy hwbot folk regularly bin multiple B-Die kits for benching. If you're looking for more credible sources, both Jon Sandstrom (elmor) from Asus ROG and Robert Hallock from AMD have also recommended B-Die.
Since it looks like there is a decent amount of interest here, I'll try contacting them as soon as I can (a week away in Taipei put me pretty far behind on life and it's catchup time).
I would be interested, but note that I'm on 4000MHz Corsair Vengeance LPX's at 2x8GB... I'd be satisfied with a 2x8GB kit, but id like to see speeds faster than the 2666 that they have...
What would make me SETTLE for 2666 is if the Dan HSLP-48 ends up fitting inside the S4 mini and does end up fitting with a slim 15mmx120mm fan, that would REQUIRE that Innodisk VLP. If I were you I'd get on the [H[ardOCP forums thread for the Dan HSLP-48 and mention to them that this RAM could be what we might need.
https://hardforum.com/threads/dan-h...50mm-heatsink.1925480/page-15#post-1043025612I actually dont know if @dondan knows about this VLP DDR4 or if hw has tested it with his HSLP-48 yet, he should be notified so he can order some and test it with his cooler and report back to us, this would give Inno3d some extra customers for thier grand achievement of VLP DDR4.
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Ionrent
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I messaged @Kmpkt on [H] but I figured I throw my thoughts out here as well to see if there's anyone else who agrees/disagrees with my thinking (warning, long read):
Here are my thoughts (I posted a bit in the SFFN thread as well). I'm coming from the perspective of wanting high performance at the expense of capacity for my main system. But I'd also like to build a Ryzen workstation where 32GB is my minimum requirement. I'm picturing two VLP DDR4 kits:
#1: 2x8GB, Single Rank (Single Sided)
#2: 2x16GB, Dual Rank (Double Sided)
8Gb Samsung B-Die chips, Non-ECC, Unbuffered, and black colored PCB for both.
If G.Skill is any indication, kit #1 can range from 2400 at 1.2V to 4266 at 1.4V depending on how the manufacturer has decided to market the kits (and to be fair, how they've pre-sorted the chips). The single rank kits are amazingly flexible.
Kit #2 would be more limited due to the dual rank configuration (max is about 3600). The timings tend to be poor for these above 3200-3400. Compatibility at higher speeds seems to be better in the beta AGESA bios updates.
For either one, you should consider a minimum XMP/DOCP profile of 3200 CL14 1.35V, but it depends on how receptive Innodisk is to the idea. They may only want to program modest JEDEC profiles like 2400 CL14 1.2V or 2666 CL15 1.2V since, I'm assuming, anything else requires additional validation and cost. I personally don't care, because I would immediately set the voltage to 1.4-1.45V and tune the memory manually. But I doubt most people would want to bother with that, so a decent XMP/DOCP profile should be included.
Another consideration is that I can already get ECC unbuffered 16GB VLP sticks from Crucial that run at 2400 and are ~$170 per stick. Users who actually need more than 16GB of memory may just go with slower ECC memory because reliability is more important for the use case. It's expensive, but how much cheaper will a small run of custom memory really be? That's where it's important to have selling points like B-Die, a faster XMP profile, and even the black PCB.
Thanks for reading!
#1: 2x8GB, Single Rank (Single Sided)
#2: 2x16GB, Dual Rank (Double Sided)
8Gb Samsung B-Die chips, Non-ECC, Unbuffered, and black colored PCB for both.
If G.Skill is any indication, kit #1 can range from 2400 at 1.2V to 4266 at 1.4V depending on how the manufacturer has decided to market the kits (and to be fair, how they've pre-sorted the chips). The single rank kits are amazingly flexible.
Kit #2 would be more limited due to the dual rank configuration (max is about 3600). The timings tend to be poor for these above 3200-3400. Compatibility at higher speeds seems to be better in the beta AGESA bios updates.
For either one, you should consider a minimum XMP/DOCP profile of 3200 CL14 1.35V, but it depends on how receptive Innodisk is to the idea. They may only want to program modest JEDEC profiles like 2400 CL14 1.2V or 2666 CL15 1.2V since, I'm assuming, anything else requires additional validation and cost. I personally don't care, because I would immediately set the voltage to 1.4-1.45V and tune the memory manually. But I doubt most people would want to bother with that, so a decent XMP/DOCP profile should be included.
Another consideration is that I can already get ECC unbuffered 16GB VLP sticks from Crucial that run at 2400 and are ~$170 per stick. Users who actually need more than 16GB of memory may just go with slower ECC memory because reliability is more important for the use case. It's expensive, but how much cheaper will a small run of custom memory really be? That's where it's important to have selling points like B-Die, a faster XMP profile, and even the black PCB.
Thanks for reading!
Hmm, I just talked to them over the phone, and they said I could order an individual amount. Are we both talking VLP SODIMMs?
I believe @Kmpkt is talking about 'regular' VLP DDR4 DIMMs (but of the custom order, hence the MOQ, basic black PCB)...
The custom order would be made with a black PCB as well as being made with Samsung B-dies which means optimal performance with Ryzen as well as being about the best chips you can get at the moment I believe. You can order single DIMMs in green from them and I am getting more details on this as well. I think they're using SK Hynix on their stock DIMMs.
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Ionrent
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Guys, I found something interesting in InnoDisk cataloque. Much lower SODIMM DDR4 than 25mm.
288pin in description. I think it’s mistake.
ECC in description. I thinks it’s possible to order with non-ECC.
288pin in description. I think it’s mistake.
ECC in description. I thinks it’s possible to order with non-ECC.
The mini dimm is a different form factor than dimm or sodimm. See also https://smallformfactor.net/news/innodisk-booth-computex-2017
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