- May 11, 2015
Again, the TIM is just fine, the problem is with clearance between the top of the die and bottom of the IHS. The large-core LGA2011 chips are soldered because the dies are still large enough to do so without damage.New Well intel is to blame on lga 115x bad tim/heat transfert. Even on broadwell-e intel is doing far better.
Smaller dies will run hotter for the same power as larger dies, simply because you have less surface area to extract heat from. this has been the case for years, ever since TDPs stopped increasing (hitting ~100W for normal consumer chips) but processes kept shrinking.Intel did clearly even worse than skylake on Kabylake
Skylake is pushing 90W out of 112mm^2 (die size of Kaby lake is not yet confirmed). RyZen has been slated at 95W for an unknown die size, and do not have an iGPU to 'pad out' die area. If the 4c8t die is cut down rather than just a binned large die, it will run into the exact same thermal issues as Intel have been dealing with.