For a long time how to balanced the obturation show cases` heat dispersion is a difficult problem. SFF case must use distinctive heat dispers for compact volume, And now I`ll show you Dual cool MK2——which could get a good volum and strong dissipation performance at the both same time.
Dual cool MK2 use dual 240 AIO to solve CPU/GPU heat.But there haven`t any fans on AIO. It`s obturation structure like a chimney could bring AIOS` heat and use two 12025 low RPM fans stabilize the whole environment. SFF case in my understood it must enlarge heat radiator`s total volum to increase total heat capacity of the whole computer instead of add more fans to make more noise (be that as it may, you also install 4 fans if you want to replace AIO device.)
As you can see MK2`s front/rear cover use window-less design. Air must go through according gap which at the under of cover.This design could reduce dust adhering compare with original direct inhalation.So it could keep computer`s dissipation performance in a long time.
All IO input have been move to base and use redirector relocate there position and direction.Front/rear have indent so that USB device will get more depth when they doing data transmission and you will not knock down this device when you doing onther things or hurry searching on the table.
Phototype image:
Hardware support specification:(the RED words which is changed in update!)
3Dsize: 250L*375H*130W=12.18L
Meteral: 7075 Aluminium with CNC +CB232 steel sheet metal bending
Motherboard: 17*17 ITX with SFX/SFX-L
Power supply: SFX
Display card: limited length 320mm, limited width 140mm, limited height 40.6mm~60mm (2 PCIE~3PCIE, could more shoulders) display card
Radiator: 55-60mm radiator(depending on column structure different position)
SYS Fan: 6*12025 fan with 120 aio/2*12025 fan with dual 240 aio/4*12025 fan with one 240 aio
AIO device: dual 240 AIO support
Disk support: 3*2.5 HDD device(maybe modify)
Dual cool MK2 use dual 240 AIO to solve CPU/GPU heat.But there haven`t any fans on AIO. It`s obturation structure like a chimney could bring AIOS` heat and use two 12025 low RPM fans stabilize the whole environment. SFF case in my understood it must enlarge heat radiator`s total volum to increase total heat capacity of the whole computer instead of add more fans to make more noise (be that as it may, you also install 4 fans if you want to replace AIO device.)
As you can see MK2`s front/rear cover use window-less design. Air must go through according gap which at the under of cover.This design could reduce dust adhering compare with original direct inhalation.So it could keep computer`s dissipation performance in a long time.
All IO input have been move to base and use redirector relocate there position and direction.Front/rear have indent so that USB device will get more depth when they doing data transmission and you will not knock down this device when you doing onther things or hurry searching on the table.
Phototype image:
Hardware support specification:(the RED words which is changed in update!)
3Dsize: 250L*375H*130W=12.18L
Meteral: 7075 Aluminium with CNC +CB232 steel sheet metal bending
Motherboard: 17*17 ITX with SFX/SFX-L
Power supply: SFX
Display card: limited length 320mm, limited width 140mm, limited height 40.6mm~60mm (2 PCIE~3PCIE, could more shoulders) display card
Radiator: 55-60mm radiator(depending on column structure different position)
SYS Fan: 6*12025 fan with 120 aio/2*12025 fan with dual 240 aio/4*12025 fan with one 240 aio
AIO device: dual 240 AIO support
Disk support: 3*2.5 HDD device(maybe modify)
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