Looks like MSI decided to put Nvidia's MXM full GTX 980s to good use.
http://www.tomshardware.com/news/msi-vortex-sff-gaming-pc,30865.html
http://www.pcworld.com/article/3019...es-mac-pro-with-two-geforce-gtx-980-gpus.html
No actual 360-degree product shots? I'll bet the PSU is a (relatively) huge external brick.
With all the IO on the back, loads of USB ports, I'd get an external hdd or an enclosure for my current hdd if I'm dropping 2k to 3k on one of these.This is one of the few pre-builts I'd be interested in buying. However if it only has M.2 slots for hard drives but no support for 2.5" hard drives, that's going to be a deal-breaker for many. I'd really prefer that they add 2.5" support as it will give you more hard drive space for the buck to upgrade with.
This is one of the few pre-builts I'd be interested in buying. However if it only has M.2 slots for hard drives but no support for 2.5" hard drives, that's going to be a deal-breaker for many. I'd really prefer that they add 2.5" support as it will give you more hard drive space for the buck to upgrade with.
I was told that the final designs would feature SLI configurations using GTX 960s, GTX 980s and GTX 980 Tis
It doesn't seem inconceivable though, since cool air is being sucked in from the bottom and only has to travel a very short path to exit with a sort of centrifugal fan. A cylinder is also an optimal shape for airflow, Apple's engineers probably started there. MSI's version suggests that the central heatsink is not necessary for the excellent performance. The CPU heatsink's performance under full load does worry, as it was 80-83°C with 19°C ambient, which would mean it could throttle with slightly warmer environments.I'm having a hard time nodding to Linus's remark on the accoustics during gaming in his video where he says it only emits unobtrusive low hum considering the tiny fan in the 1U form factor like PSU and the convoluted air path into and out from the GPU and CPU heatsinks.
Regarding the "very short path" and "optimal shape for airflow"... I understand it partially if you mean the cylindrical shape of the case preventing the air path from dispersing multi-directionally and the lack of vent holes on the surrounding side wall reducing leaked noise, but the issue is the way heatsinks are mounted on the PCBs. They are basically downdraft coolers against the PCBs with space between the heatsink and the case wall as well as space between the heatsink and the PCB for air to enter and exit the fin stack but with no designated direction in which air "should" go between the fins (unless a fan is slapped right onto one side of the heatsink), so I imagine, due to the static pressure required for air to go between the fins, that quite a portion of air that reach up to the lowest tip of the heatsink would inevitably cut a shortcut path (unless, like I said, a fan is attached right onto the heatsink that forcibly sucks air into the fins) and get past the heatsinks without a chance to go between the fins. In this regard the cooling design of this case is pretty inefficient to me, at least in my head.It doesn't seem inconceivable though, since cool air is being sucked in from the bottom and only has to travel a very short path to exit with a sort of centrifugal fan. A cylinder is also an optimal shape for airflow, Apple's engineers probably started there. MSI's version suggests that the central heatsink is not necessary for the excellent performance.