Hey, I can offer some insight as I have made a couple of cases with PLA from different high quality manufacturers like Prusament and Extrudr. I can safely say that PLA is not the way to go. While its glass temperature may be around 60C, it will still warp over time if exposed consequent to much lower temperatures.PLA suffices in terms of thermal stability as Radiators mostly don’t reach temperatures higher than 60 C
I've had 6mm thick parts warp over time being inside a case with a simple Haswell i3 and a 1050ti while not being near any radiator. This was after about 6 months of usage. I've also had parts that were near the backplate of a 3080 warping after a couple of weeks, although the backplate was nowhere near 60C.
Glass temperature is not the only metric to look at IMO when deciding on temperature resistance of a filament used to print computer cases. It only tells you how hot you can go for the case to instantly loose stability, but nothing about stability over time.
On a more positive note, I also have an ABS case which shows absolutely no signs of warping after 2 years so ASA should be equally good!