Prototype DAN HSLP-48: A powerful sub 50mm heatsink

[dondan]

@Kmpkt Yes you are right

Here are some ideas for prototype 2:

Heatsink: Downsize width from 130mm to 120mm
Heatsink: Maybe increasing the fin spacing +0,2mm and reducing the fin count from 60 to 54

Heatpipe: Increasing bend radius from 10mm to 15-18mm
Heatpipe: One sample with 4 heatpipes and one with 5-6 heatpipes

CPU-Plate: For both samples moving the heatpipes closer together.

Clip: Optimise clip mounting I will focus on fans with a thickness of 12mm and 15mm.

 

[Kmpkt]

I could probably look this up myself, but is one of your test fans significantly above the others with respect to static pressure? I'd be curious to know how your denser stack did with higher vs lower static pressure. Also Yate Loon sent me a double set of their high static pressure 92x15 fans (2.4mmH2O I believe) if you'd like them for testing.

 

[dondan]

Today I testes the HSLP-48 Copper with a 7700k. (Before you ask I will not delid it)
I can't believe that Intel will use TIM also on the new 2066 Socket. Soldering a DIE result in so much better temps.
My 5820K with 6 cores and a TDP of 140W stays cooler as an 7700k with 4 core and a TDP of 91W.


7700K Turbo-Off (4,2Ghz) - Bench Table
Prime95 v26.6 8K Test – 15min each

Heatsink------------Fan---------------Position-----Mode----------RPM--------Room Temp--------Core Temp
HSLP-48 Copper.....A12x15..............Top..........Pushing.........1800..............25........................83°C
Cryorig C7..............A12x15..............Top..........Pushing.........2400..............25........................90°C

7700K Turbo-On (4,4Ghz) - Bench Table
Prime95 v26.6 8K Test – 15min each

Heatsink------------Fan---------------Position-----Mode----------RPM--------Room Temp--------Core Temp
HSLP-48 Copper.....A12x15..............Top..........Pushing.........1800..............25........................92°C
Cryorig C7..............A12x15..............Top..........Pushing.........2400..............25........................100ü°C (throttle)



If you touch the HSLP-48 under heavy load its is very cool also the heatpipes arn't hot, this is very strange. I am not sure if this is normal.



Tomorrow I will test the AXP-100 on the 7700k. If its perform linea we should see 5°C better temps on it. So if my prototype 2 is

2-3 better as the AXP-100 we reach the temp goal that I am aiming for. ~15°C better as the C7.

 

[Kmpkt]

Are you benching against the L9i as well? How about the LP53?

 

[dondan]

On future samples I will do that.

 

[EdZ]

My 5820K with 6 cores and a TDP of 140W stays cooler as an 7700k with 4 core and a TDP of 91W.

It's all down to die size: the 5820K is 356mm^2, while the 7700k is 122.4mm^2. That's 0.39Wmm^-2 vs. 0.74Wmm^-2 that needs to be dissipated. Die size also determines whether you can solder the IHS: if the die is too small, soldering it to the IHS can result in delamination and either terrible thermal performance or catastrophic failure.

 

[dondan]

Then they could use liquit metal TIM.

 

[Kmpkt]

While I don't love the TIM solution that Intel has chosen to use in their chips, it sounds like they have decent justification for it. Give this article by Der8auer a read, it's pretty excellent:

http://overclocking.guide/the-truth-about-cpu-soldering/

TLDR; the only good choices for effectively soldering small die silicon chips to the IHS involve complex processes using expensive/rare metals such as indium, gold and silver.

As far as not using a liquid metal TIM, I find myself wondering if the TIM they've chosen is an essentially meant to be an unofficial barrier to higher overclocks that might in turn increase their RMA rate. Considering they've chosen to take the line that overclocking doesn't void warranty and then chosen to use that as a marketing advantage over AMD, engineering their chips to essentially thermal throttle at a safe overclock seems like a mighty convenient way to keep users from breaking shit.

 

[VegetableStu]

Edz already mentioned Der8auer's article in his link above, to pre-empt ._.

 

[Kmpkt]

Well shit...

 

[Kwirek]

If you touch the HSLP-48 under heavy load its is very cool also the heatpipes arn't hot, this is very strange. I am not sure if this is normal.

I had the same experience with mine before I delidded it. The heatpipes were cool whatever I threw at it.

After delidding they can be uncomfortably hot (but cpu temp never above 60oC), as a comparison.

 

[EdZ]

Then they could use liquit metal TIM.

'Liquid metal' TIMs are usually eutectic Indium/Gallium allows. That stuff is nasty, I wouldn't let it anywhere near any metallics I want to keep uncontaminated. Even if the upper die surface and lower IHS surface are protected with an extra layer (as in soldered process), you have the issue that the TIM is mobile - unlike Indium solder - so can infiltrate other areas e.g. under the flip-chip and attack the solder balls and BEOL side of the die, or surrounding IHS areas where Indium & Gallium love to eat into Aluminium (and even Copper) and cause embrittlement and even physical deformation (alloy areas expand, pushing IHS away from die).

 

[dondan]

UPDATE:

So my work on the 6 heatpipe design is nearly done. Here are the new dimensions:


Specifications:

Socket Support: 1155. 1151, 1150, 1156, 2011 square and narrow Ilm, AM4
Total Dimensions: 48 (H) mm x 121 (W) mm x 143 (L) mm - including heatpipes
Fin Area Dimension: 18 (H) mm x 121 (W) mm x 116,5 (L) mm, 59 fins
Material: copper and aluminum base
Heatpipes: 4x 6mm heatpipes
Total Surface: ~128500mm²


So as you maybe see I changed also the surface size for compatibility. The width is 9mm smaller and I reduced the fin count from 60 to 59 for easier clip mounting with a 120mm fan.
On the rednerings I used a 120x120x15mm Silverstone fan. I also made some changes to the fan clip mount holes. Now we have holes on the outside for 120mm fans with a thickness of 15mm.
The inner mount holes are for 15, 14 and 12mm fans.

Pictures:

 

[Kmpkt]

Looks good!

 

[dondan]

I had a bit of time and played with my render software. A nickel plate version of the HSLP-48. I choose a olive colored type:


(Click for 3K)

 

[darksidecookie]

I had a bit of time and played with my render software. A nickel plate version of the HSLP-48. I choose a olive colored type:


(Click for 3K)

just curious what software did you use to render and model this image?

 

[grumpyrobin]

see if you can get noctua to send you one of their prototype 0.2 ml clearance fans that they showed at computex. they work especiailly good with heavy resistance.

 

[Curiosity]

They're no longer prototypes, the NF-A12x15 is released as far as I know.
I think someone on [H] has one.

 

[Kmpkt]

Are you seriously considering doing black nickel plating or is this just for fun's sake?

 

[Boil]

see if you can get noctua to send you one of their prototype 0.2 ml clearance fans that they showed at computex. they work especiailly good with heavy resistance.

They're no longer prototypes, the NF-A12x15 is released as far as I know.
I think someone on [H] has one.

I believe @grumpyrobin is talking about the still in development next-gen NF-A12 with the Liquid Crystal Polymer blades, which allow an extremely tight tolerance /clearance to the fan housing...

The NF-A12x15 is available now, but that does not use the LCP tech...