The latest rumours suggest Kaby Lake will indeed see a new chipset through series 200, which was previously attributed to Cannonlake before it's delay. This is also known as Union Point.
The speculation here seems to be that the main driving force for this will be 3D Xpoint (Intel Optane) compatibility. The Kaby Lake CPUs themselves should be compatible with current series 100 boards.
They also mention a bump of the chipset lanes up to 24x PCI-E 3.0.
http://wccftech.com/intel-kaby-lake-200-series-chipset-processor-platform/
The speculation here seems to be that the main driving force for this will be 3D Xpoint (Intel Optane) compatibility. The Kaby Lake CPUs themselves should be compatible with current series 100 boards.
They also mention a bump of the chipset lanes up to 24x PCI-E 3.0.
http://wccftech.com/intel-kaby-lake-200-series-chipset-processor-platform/
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