News Kaby Lake & Union Point (Series 200)

The latest rumours suggest Kaby Lake will indeed see a new chipset through series 200, which was previously attributed to Cannonlake before it's delay. This is also known as Union Point.

The speculation here seems to be that the main driving force for this will be 3D Xpoint (Intel Optane) compatibility. The Kaby Lake CPUs themselves should be compatible with current series 100 boards.

They also mention a bump of the chipset lanes up to 24x PCI-E 3.0.

http://wccftech.com/intel-kaby-lake-200-series-chipset-processor-platform/
 
Last edited:

|||

King of Cable Management
Sep 26, 2015
775
759
So should we put together a small petition of what features and options we'd like to see in the next Impact board for ASUS (or another manufacturer if they want to get into the high-end Mini-ITX space)? I think a number of people were not enamored with the current version of the Impact and the feature set of other mITX boards haven't been any more impressive.

Here is my vote for the M9I (I'm assuming the extra 4 HSIO lanes will support Intel RST):

6 USB 3.1 (Gen 1; 4 on rear I/O, 2 at header)
4 USB 2.0 (2 on Type-C TB/DP on rear I/O, 2 at header)
PCI-e 3.0 x2 to B-Key M.2 for WiFi
PCI-e 3.0 x2 to revised Tehuti Networks TN4010 MAC (http://www.tehutinetworks.net/images/UL240756/TN4010 Product Brief(1).pdf; need to get it PCI-e 3.0 x2 instead of PCI-e 2.0 x4) to Intel X557-AT (http://ark.intel.com/products/88343/Intel-Ethernet-Connection-X557-AT) for low cost & low power 100/1000/10G ethernet
PCI-e 3.0 x4 to Intel Alpine Ridge (Type-C on rear I/O)
PCI-e 3.0 x4 to SFF-8643 with SFF-8087 for U.2 and 4x SATA III support (assuming this is possible)
PCI-e 3.0 x4 to SFF-8643 with SFF-8087 for U.2 and 2x SATA III support (again, assuming...) *or* M-Key M.2 with NVMe PCI-e and SATA drive support
PCI-e 3.0 x4 to M-Key M.2
PCI-e 3.0 x4 to M-Key M.2
TPM header
4 x 4-pin fan headers on board
 

jeshikat

Jessica. Wayward SFF.n Founder
Silver Supporter
Feb 22, 2015
4,969
4,780
I hope they increase the bandwidth between the chipset and the CPU.
 

|||

King of Cable Management
Sep 26, 2015
775
759
I hope they increase the bandwidth between the chipset and the CPU.

That I doubt because of the backward/forward compatibility they are talking about. It will probably remain DMI 3.0 (extended PCI-e 3.0 x4).