I've done lots and lots of searching on this subject when I was discussing alternate layouts and features for the S700 case with Salvo.
Basically, you have to break this down into simple thermodynamics. If you're cooling something, you're stuck at a cooling rate determined by effectiveness of the design, (fin stack (air) or fin density (water)), and the max thermal conductivity of the medium (air or water). The reason there isn't that much difference between air coolers and water coolers is because the heat from the CPU is eventually going to a copper stack and being sent from the stack to the
air exhausting the case.
There have been several interesting tests done on this on Martinsliquidlab.org back in 2012. I was fortunately able to read them before they went offline, but there are a couple of other less in-depth threads about it
here.
While your idea is interesting, it unfortunately won't work. Here's why:
When you sandwich two radiators together there are a few things that matter, loop order, fan placement/configuration, and radiator size.
When you try to cool your system, cool air will flow over radiator 1 and absorb as much heat as it can from the fans. When it passes through radiator 2, the air will have lost a lot of it's thermal potential when it passed through radiator 1. Thus, not really cooling. In fact, in a lot of the tests they found that 2 radiators had negligible improvements over having only 1. (Partially because if you think about it, radiator 1 gets all the cooling, radiator 2 is being heat-soaked).
People thought that they could possibly increase performance by moving more air in using a (Fan | radiator | Fan | radiator | Fan ) setup but it doesn't seem to move more air, it just seems to make the flow choppy.
I would guess that the only way you could do this and see any kind of performance boost is by using 2 extremely thin radiators (10mm) and stacking them. This way you could separate and cool 2 loops, (take up roughly the same fins stack area as you would normally), and in the cooling process you wouldn't need to worry about heat contamination from GPU to CPU.
It would have to be a very unique use case for it to be a plausible solution. Sorry