@dondan is there a reason most of the cases you make don't have front perforations? My Lian Li Q58 (I know not your case) front panel heats up quite a bit especially with a FE card as the hot air sits right there. Even without the ability to mount a fan in the front, having performated front...
Dan do you have a render of how the latest version looks? Having a bit of trouble visualizing this:
For top down heatsinks wouldn't it pull in fresh air from the side panel? Or you're saying flip the fans and exhaust hot air out the side?
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