I'm relatively new to both desktop PC hardware and SFF PCs but I'm experienced with PC maintenence and Cellphone repair. I just built my first ever new Desktop in the Silverstone RVZ03 ~2 months ago and now I interest myself with designing a sub 10L case that can house the components that I'm currently using minus the powersupply.
The parts used in the build are:
Case: Silverstone RVZ03 black
Motherboard: MSI B450I gaming plus
Cooler: AMD Wraith prism with the stock fan removed with an Arctic P12 mounted on the side panel to exhaust air through the heatsink (the stock RGB fan can fit if you take off the top most plastic shroud but it's loud even at 1200RPM max)
CPU: AMD Ryzen 2200g 3.9 @1.38V: (I will soon upgrade to either a 3300X or a 2600)
RAM: 2x8 Gb Corsair Vengeance LPX @3066Mhz C16 (never could hit 3200Mhz regardless of SOC voltage or RAM voltage I suspect the Zen 1 IMC is the weak point)
GPU: Sapphire Nitro OC RX470 4Gb: I bought this card dirt cheap second hand and cleaned it up and overclocked it to 1300mhz on 1.1V ( I can push higher since there still it temprature headroom but I prefer the silence)
PSU: Cooler Master Elite V3 600W: The stock powersupply fan was extremely loud compared to the rest of the system so I replaced it with an Arctic P12 that's controlled from the motherboard
Storage: Kingston 480Gb 2.5 Sata 3 SSD and a Seagate 2tb mobile hard drive (One of my family members ruined the USB connector on an external seagate hard drive so I took the enclosure apart and reused the hard drive as mass storage for games and phone backups)
Fans: The two included 120x15mm fans are used for now as they're adequate and relatively quiet on low RPMs but I plan to replace them with Arctic P12s as I've seen how good they are after using them for both CPU and PSU cooling
My current configuration is very quiet compared to my XPS 15 9570 and runs very cool at ~60c CPU and ~65c GPU for gaming. I'm currently CPU bottlenecked however I don't think tempratures will vary wildly after the CPU upgrade as the 2200g has paste between the head spreader and the die whereas the 3300x and the 2600 are soldered between the heat spreader and the die.
I'm overall very happy with the system however I wish I waited for 10th gen intel so I could play around with a 10400 or 10600k with direct die cooling (Direct die cooling is almost impossible on AM4 due to socket design)
I'm looking forward to learn and share on this forum!
The parts used in the build are:
Case: Silverstone RVZ03 black
Motherboard: MSI B450I gaming plus
Cooler: AMD Wraith prism with the stock fan removed with an Arctic P12 mounted on the side panel to exhaust air through the heatsink (the stock RGB fan can fit if you take off the top most plastic shroud but it's loud even at 1200RPM max)
CPU: AMD Ryzen 2200g 3.9 @1.38V: (I will soon upgrade to either a 3300X or a 2600)
RAM: 2x8 Gb Corsair Vengeance LPX @3066Mhz C16 (never could hit 3200Mhz regardless of SOC voltage or RAM voltage I suspect the Zen 1 IMC is the weak point)
GPU: Sapphire Nitro OC RX470 4Gb: I bought this card dirt cheap second hand and cleaned it up and overclocked it to 1300mhz on 1.1V ( I can push higher since there still it temprature headroom but I prefer the silence)
PSU: Cooler Master Elite V3 600W: The stock powersupply fan was extremely loud compared to the rest of the system so I replaced it with an Arctic P12 that's controlled from the motherboard
Storage: Kingston 480Gb 2.5 Sata 3 SSD and a Seagate 2tb mobile hard drive (One of my family members ruined the USB connector on an external seagate hard drive so I took the enclosure apart and reused the hard drive as mass storage for games and phone backups)
Fans: The two included 120x15mm fans are used for now as they're adequate and relatively quiet on low RPMs but I plan to replace them with Arctic P12s as I've seen how good they are after using them for both CPU and PSU cooling
My current configuration is very quiet compared to my XPS 15 9570 and runs very cool at ~60c CPU and ~65c GPU for gaming. I'm currently CPU bottlenecked however I don't think tempratures will vary wildly after the CPU upgrade as the 2200g has paste between the head spreader and the die whereas the 3300x and the 2600 are soldered between the heat spreader and the die.
I'm overall very happy with the system however I wish I waited for 10th gen intel so I could play around with a 10400 or 10600k with direct die cooling (Direct die cooling is almost impossible on AM4 due to socket design)
I'm looking forward to learn and share on this forum!
