It's too small and chipsets are almost always custom pieces of silicone on packages or whatever words are used. What you've circled is most likely just some chip for supporting circuitry.
There will be a different PCB used for the Navi APUs coming later in the year, or so I've heard. And overall, the supposed R5 3600X system was drawing less power than the 9900k system during the run, don't forget that, and when the 9900k was allowed to run stock without any limitations.
I'm buying that motherboard as soon as possible. And maybe an Athlon 200GE, it's enough for my needs :P The two M.2 NVMe slots are extremely useful :P
Wait... Does this mean that crossfire is now possible?
Afaik the A300 chipset is actually just the CPU’s built in ‘chipset’ of sorts, allowing much more space on the board considering they don’t need an extra BGA package sitting there now.
Right, so, list of things to get:
A graphics card that fits
The 400W AC-DC and DC-DC combo thing
A new CPU cooler
That seems to be about it. You would've thought that I'd have had these things already, but no :P
Sorry this is taking so long. But, well, I've obtained my own 3D printer now, and I'm learning to use it (best settings and such). And of course, the design is going through some changes. 3.2 litres with full internal power now.
Well, A300 is just what the CPU itself has available. I mean, all Ryzen CPUs are essentially SoCs (and I really cannot see anywhere a chipset could go on the board, even the underside looks like it doesn't have enough space). I do think it's an issue of just being unable to fit the chipset anywhere?
Well, the fans blow air down into the heatsink, with the air then going out to either side in the example you posted up there (the fan flows parallel to the fins). The dynatron cooler would just have the air exhausted out at one side instead of both.
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