Today SilverStone has announced the NT09-115X, a 45mm tall CPU heatsink for Intel LGA 1156/1155/1150/1151 processors with a TDP of 65W or less. The heatsink itself is a fairly basic extruded aluminum affair like the stock heatsinks but instead with sturdy-looking spring-loaded screws to attach the heatsink to the motherboard instead of the sometimes frustrating plastic push-pins that Intel typically uses. The mounting screws thread into an included backplate that is intended to reduce motherboard warping.
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