Gear Seekers showed this in their follow-up video:
[MEDIA=youtube]BY0YIMGWnJw:223[/MEDIA]
Now, I have watched a BUNCH of videos on the H1, so I get them confused some, but one video had temps with TG & with the back panel moved to the front, looks like GPU temps dropped at least 10 degrees C or so with a perforated front panel in place of the TG front panel?
Another video I just watched stated that NZXT will be making some changes to the H1 going forward; slightly longer PSU cables & a PCIe Gen4 riser cable...!
Here is to hoping that the (forthcoming) B550 ITX mobos have an onboard USB Type-C header...!
Perfect all-AMD all-PCIe Gen4 gaming rig:
AMD Ryzen 7 3700X 8c/16t CPU
B550 ITX mobo (with onboard Type-C USB header)
16GB G.Skill Trident Z Neo 3600/16 DDR4 RAM
1TB Sabrent Rocket 4.0 M.2 NVMe SSD
Triple fan open air Radeon RX 5700 XT GPU (7nm+ refresh)
And who knows, maybe NZXT will sell the perforated back panels as a stand-alone SKU, then one could get one, snip off that single alignment pin that is causing interference issues & Bob's your uncle...?!? ;^p
