I am in need of updating & downsizing my main CAD workstation.
Currently system is an i7 4770K housed in a Corsair Carbide Air 540 case.
Case:- Lazer3D LZ7 generally fitted out with black panels & red corner components.
Top Panel will be the new XL fully vented version.
CPU:- Intel i7-8700K
Cooler:- Noctua NH-L12S
Motherboard:- Asrock Fatal1ty Z370 Gaming ITX
Memory:- 32GB Corsair Vengeance LPX Series DDR4-3200
Main Boot & CAD Work Drive:- Samsung 960 PRO NVMe SSD, PCIe 3.0 M.2 1TB
Drive for Steam collection & Media:- Seagate 2TB FireCuda 2.5" Solid State Hybrid Drive
Swap Drive for future mobile workstation (Intel Haydes Canyon NUC):- 2TB Samsung 860 EVO M.2 SATA Drive housed in a Sabrent M.2 SSD to 2.5" Aluminium Enclosure (EC-M2SA)
GPU:- Gigabyte GTX 1080 ITX Mini Graphics Card
PSU:- Corsair SF600 80 Plus Gold SFX Power Supply
Case Fan:- Prolimatech Ultra Sleek Vortex 14
Custom cables by me.
Thermal Grizzly Conductive Paste to CPU
This system will drive 3 No Monitors:- Main monitor is a 4K 40" Phillips BDM4065UC flanked on either side by Dell 30" 3008WFP
I will document this build over the coming weeks once the snow has disappeared in the UK, allowing for postal delivery of components to arrive!!
Just a thought, I'm considering cutting an M.2 sized rectangular hole in the underside of the main base panel of the case in order to gain access to the NVMe SSD drive which is located on the underside of the motherboard.
I feel this may help with gaining rapid physical access to the drive if needed for possible hardware trouble shooting further down the line, & would also improve cooling of this component.
Does anyone know how easy it is to successfully cut this perspex material or is there a risk of it shattering?
Currently system is an i7 4770K housed in a Corsair Carbide Air 540 case.
Case:- Lazer3D LZ7 generally fitted out with black panels & red corner components.
Top Panel will be the new XL fully vented version.
CPU:- Intel i7-8700K
Cooler:- Noctua NH-L12S
Motherboard:- Asrock Fatal1ty Z370 Gaming ITX
Memory:- 32GB Corsair Vengeance LPX Series DDR4-3200
Main Boot & CAD Work Drive:- Samsung 960 PRO NVMe SSD, PCIe 3.0 M.2 1TB
Drive for Steam collection & Media:- Seagate 2TB FireCuda 2.5" Solid State Hybrid Drive
Swap Drive for future mobile workstation (Intel Haydes Canyon NUC):- 2TB Samsung 860 EVO M.2 SATA Drive housed in a Sabrent M.2 SSD to 2.5" Aluminium Enclosure (EC-M2SA)
GPU:- Gigabyte GTX 1080 ITX Mini Graphics Card
PSU:- Corsair SF600 80 Plus Gold SFX Power Supply
Case Fan:- Prolimatech Ultra Sleek Vortex 14
Custom cables by me.
Thermal Grizzly Conductive Paste to CPU
This system will drive 3 No Monitors:- Main monitor is a 4K 40" Phillips BDM4065UC flanked on either side by Dell 30" 3008WFP
I will document this build over the coming weeks once the snow has disappeared in the UK, allowing for postal delivery of components to arrive!!
Just a thought, I'm considering cutting an M.2 sized rectangular hole in the underside of the main base panel of the case in order to gain access to the NVMe SSD drive which is located on the underside of the motherboard.
I feel this may help with gaining rapid physical access to the drive if needed for possible hardware trouble shooting further down the line, & would also improve cooling of this component.
Does anyone know how easy it is to successfully cut this perspex material or is there a risk of it shattering?