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No fan on the L12S could be workable, but probably not with full mesh side panels. I suspect you'd need to put tape/plastic/whatever over the mesh near the motherboard except for directly above the heatsink.I think that clear adhesive backed plastic in strategic locations could improve the temperatures of both air and water cooled builds by controlling where the intake/exhaust air comes from and goes to. In most SFF cases including Ghost S1, NCASE (early revisions) and DAN, the limited grille area forces air to take certain paths. With a full mesh side panel the air can come from anywhere, so any given airstream cross section has less flow.For a given exhaust volume from an exhaust fan, if there's twice the intake area along the side panels you're getting half the air speed. There's also the concern of most of the intake air coming from the part of the mesh closest to the fan and having very little airflow through the mesh far from the far. A small grille area may equalize flow over its whole area better.
No fan on the L12S could be workable, but probably not with full mesh side panels. I suspect you'd need to put tape/plastic/whatever over the mesh near the motherboard except for directly above the heatsink.
I think that clear adhesive backed plastic in strategic locations could improve the temperatures of both air and water cooled builds by controlling where the intake/exhaust air comes from and goes to. In most SFF cases including Ghost S1, NCASE (early revisions) and DAN, the limited grille area forces air to take certain paths. With a full mesh side panel the air can come from anywhere, so any given airstream cross section has less flow.
For a given exhaust volume from an exhaust fan, if there's twice the intake area along the side panels you're getting half the air speed. There's also the concern of most of the intake air coming from the part of the mesh closest to the fan and having very little airflow through the mesh far from the far. A small grille area may equalize flow over its whole area better.
