Normal
No case yet so no temps but the CPU carry over from last build is a 2700x (hot). Node 202 is my temporary case until Dan A4 available - so all parts are for the Dan. I opted for a non heat-sinked version of my WD Black because of its 10mm height. How much total clearance is there for rear M.2 heat-sinks? How about to make thermal pad contact? Would you recommend switching to 3700x CPU?