The 7th generation Core “Kaby Lake” CPUs, and the companion 200-series chipsets are expected to launch at the 2017 International CES show, early January next year. Even then, it seems that the 300 series is already in the works, with a few major changes lined up, according to motherboard manufacturer sources.
The decision is expected impact existing third-party Wi-Fi and USB 3.1 chip makers including Broadcom, Realtek Semiconductor, both major suppliers of WLAN chips as well as ASMedia Technology, which has a major share in the USB 3.1 market.
Although ASMedia is expected to see dropping orders for USB 3.1 host chips, the standardisation of USB 3.1 technology will accelerate development of USB 3.1-based devices and increase demand for related chips and 10G signal redrivers and retimers, allowing ASMedia to land new orders.
ASMedia’s orders from AMD for its high-speed transmission interface chipset are expected to further lower the impact from Intel’s plan.
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