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The most important piece of info here would be the dram part number. That determines the die used and might tell us about OC headroom. I would ask the seller for a detailed picture of the modules, since Thp isn't able to give that info. It would show as a letter after the colon at the very end. Or via a 5 letter number that can be translated with the Micron FPGA converter.That claimed production date of late 2019 gives hope that this might be a good recent die revision (Rev.E would be best case, J might still be great, the others are more uncertain)
The most important piece of info here would be the dram part number. That determines the die used and might tell us about OC headroom. I would ask the seller for a detailed picture of the modules, since Thp isn't able to give that info. It would show as a letter after the colon at the very end. Or via a 5 letter number that can be translated with the Micron FPGA converter.
That claimed production date of late 2019 gives hope that this might be a good recent die revision (Rev.E would be best case, J might still be great, the others are more uncertain)
