MORE KOOL-AID...!!!
This was from a speculation article about a month or so before WWDC 2013...
Ditch the front I/O & have a TouchID power button behind the Apple logo...
Processors: 7nm Zen 2 Ryzen Threadripper 3
- 3990WX 64C/128T, 3.5GHZ/4.2GHz, 250W
- 3970WX 48C/96T, 3.5GHZ/4.2GHz, 250W
- 3950X 32C/64T, 3.7GHz/4.4GHz, 180W
- 3920X 24C/48T, 3.7GHz/4.4GHz, 180W
Memory: Quad-channel, ECC DDR4, eight DIMM slots, maximum 512GB BTO, 64GB standard (4 @ 16GB DIMMs), user serviceable
Samsung A-die DIMMS, high-speed, low-latency, high-density, up to 64GB sticks
Storage: T2 (T3?) with dual Apple-proprietary SSDs in RAID, ~4GB/s read and write, 2 TB standard, up to 8 TB BTO
Graphics: PCIe 4.0, two triple-width slots (x16, x16), one double-width slot (x8)
- AMD Radeon VII, 7nm Vega 20, 60CU, 16GB HBM2
- AMD Radeon RX 3090X, 7nm Navi 20, 64CU, 8GB GDDR6 (available Q2 2020)
- AMD Radeon RX 3080X, 7nm Navi 10, 56CU, 8GB GDDR6
- AMD Radeon RX 3070X, 7nm Navi 10, 48CU, 8GB GDDR6
2.5-width slots give dual-width GPUs room to breathe
x8 dual-width slot for the 12G SDI 8K video I/O folks, or a wicked fast NVMe-based RAID card
Ports: four TB3 / USB-C, four USB-A, dual 10Gb Ethernet, one 3.5mm headphone jack
The above could be in the middle chassis, but if it could all be crammed into the far right chassis (without thermal throttling issues), that would be great...
Oh yeah, and if we could get that in Space Grey...? Thanks, Tim...!
