Join the Discussion - To hell with nVidia's definition of SFF ready. What should be the actual SFF standard?

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I agree with the status on the current market (present & even near future).
I would even add that the SFF world above/equal of 10L is becoming a bit boring with tons of uninspired copy/paste setups, with unoptimized airflow, unpractical layout, oversized & uneffective cooling solution...

As you mentionned, innovation could come from the MB, here are the leads I can suggest :
Minisforum with mobile cpu (BD790i for example) is offering interesting exhaust path through rear i/o shield and 2xm.2 on the recto of the MB. Issue of the location of the heatsink is that is can interfere with the case (got the issue with the SM550, not with the formD T1)
Arrival of new SOC like AMD Ryzen™ AI Max 300 Series with powerful integrate GPU (approx performance of a RTX 4060/4070). However except some OEM, like Framework (mini ITX), I did not see any other more standard OEM going to this market
On the GPU side, maybe you could check compatibility with deshroudded GPU, with a specific can fixation on the side panel to make easy process.

<blockquote data-quote="MarcParis" data-source="post: 292551" data-attributes="member: 331">I agree with the status on the current market (present &amp; even near future).I would even add that the SFF world above/equal of 10L is becoming a bit boring with tons of uninspired copy/paste setups, with unoptimized airflow, unpractical layout, oversized &amp; uneffective cooling solution...As you mentionned, innovation could come from the MB, here are the leads I can suggest : <ul>
<li data-xf-list-type="ul">Minisforum with mobile cpu (BD790i for example) is offering interesting exhaust path through rear i/o shield and 2xm.2 on the recto of the MB. Issue of the location of the heatsink is that is can interfere with the case (got the issue with the SM550, not with the formD T1)</li>
<li data-xf-list-type="ul">Arrival of new SOC like AMD Ryzen™ AI Max 300 Series with powerful integrate GPU (approx performance of a RTX 4060/4070). However except some OEM, like Framework (mini ITX), I did not see any other more standard OEM going to this market</li>
</ul>On the GPU side, maybe you could check compatibility with deshroudded GPU, with a specific can fixation on the side panel to make easy process.</blockquote>

[QUOTE="MarcParis, post: 292551, member: 331"] I agree with the status on the current market (present & even near future). I would even add that the SFF world above/equal of 10L is becoming a bit boring with tons of uninspired copy/paste setups, with unoptimized airflow, unpractical layout, oversized & uneffective cooling solution... As you mentionned, innovation could come from the MB, here are the leads I can suggest : [LIST] [*]Minisforum with mobile cpu (BD790i for example) is offering interesting exhaust path through rear i/o shield and 2xm.2 on the recto of the MB. Issue of the location of the heatsink is that is can interfere with the case (got the issue with the SM550, not with the formD T1) [*]Arrival of new SOC like AMD Ryzen™ AI Max 300 Series with powerful integrate GPU (approx performance of a RTX 4060/4070). However except some OEM, like Framework (mini ITX), I did not see any other more standard OEM going to this market [/LIST] On the GPU side, maybe you could check compatibility with deshroudded GPU, with a specific can fixation on the side panel to make easy process. [/QUOTE]

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