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I think we've already said the general plan at the beginning of thread and also in few comments. We're investigating option of splitting the cover between two side pieces and simple panel with bent edges, but this requires complex stamping of those side pieces and also figuring out proper attachment to them. Also such change means potential change of the vertical stand, which in current form already had it's issues, so we may end up with a completely different looking stand. Finally there's the pass-through perforation for GPU/AIO where nothing looks as good as the cover in 2.0 and we may end up with perforating the cover panel almost completely.If that 308 mm dimension includes the PCI bracket part sticking out for screws, then it might squeeze in the 3.0 as we want to raise the middle rail a bit for a 52 mm AI package, otherwise it's long to fit inside the case.
I think we've already said the general plan at the beginning of thread and also in few comments. We're investigating option of splitting the cover between two side pieces and simple panel with bent edges, but this requires complex stamping of those side pieces and also figuring out proper attachment to them. Also such change means potential change of the vertical stand, which in current form already had it's issues, so we may end up with a completely different looking stand. Finally there's the pass-through perforation for GPU/AIO where nothing looks as good as the cover in 2.0 and we may end up with perforating the cover panel almost completely.
If that 308 mm dimension includes the PCI bracket part sticking out for screws, then it might squeeze in the 3.0 as we want to raise the middle rail a bit for a 52 mm AI package, otherwise it's long to fit inside the case.
