Join the Discussion - To hell with nVidia's definition of SFF ready. What should be the actual SFF standard?

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If you used a paper thin amount of paste, repaste the CPU and use a good amount and see if that fixes it. Some people have reported the IHS being way out of spec. It should be completely flat. The base of the cooler may be slightly convex which is normal. It was not an issue until Ryzen chiplet design offset the heat from the middle to the edge of the die. If the base is overly convex and the IHS isn't flat (also convex) then the edge chiplets dont get cooled well. So if you use the minimum amount of paste, like paper thin application, it wont transfer heat on the edges on Ryzen. This is what happened to me and a repaste reduced the severity of the spikes.

[QUOTE="msystems, post: 266061, member: 2001"] If you used a paper thin amount of paste, repaste the CPU and use a good amount and see if that fixes it. Some people have reported the IHS being way out of spec. It should be completely flat. The base of the cooler may be slightly convex which is normal. It was not an issue until Ryzen chiplet design offset the heat from the middle to the edge of the die. If the base is overly convex and the IHS isn't flat (also convex) then the edge chiplets dont get cooled well. So if you use the minimum amount of paste, like paper thin application, it wont transfer heat on the edges on Ryzen. This is what happened to me and a repaste reduced the severity of the spikes. [/QUOTE]

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