Normal
The goop itself is perfectly fine. The problem is the gap between the top of the die and underside of the IHS:If you could remove the IHS, leave the Intel goop intact, and re-install the IHS with the gap reduced, you would likely achieve all the gains of delidding.Frying your CPU may still be a concern: the pad is conductive, and quite a bit larger than the die. Leaving it to flop off the edge is as bad as having 'liquid metal' TIM on the substrate (so adding insulation around the die would likely be necessary), and cutting it to size would require careful replacement of the IHS to prevent that small rectangle slipping off of the die during re-lidding.The other concern would be pad thickness: too thin and you have an even worse problem than you started with, as there will no longer by any contact between the die and the IHS. Too thick, and you now have the mounting force of the heatsink going directly to the die (due to it being rigidly coupled to the underside of the IHS) rather than being carried through the IHS mounting to the edge of the substrate.
The goop itself is perfectly fine. The problem is the gap between the top of the die and underside of the IHS:
If you could remove the IHS, leave the Intel goop intact, and re-install the IHS with the gap reduced, you would likely achieve all the gains of delidding.
Frying your CPU may still be a concern: the pad is conductive, and quite a bit larger than the die. Leaving it to flop off the edge is as bad as having 'liquid metal' TIM on the substrate (so adding insulation around the die would likely be necessary), and cutting it to size would require careful replacement of the IHS to prevent that small rectangle slipping off of the die during re-lidding.
The other concern would be pad thickness: too thin and you have an even worse problem than you started with, as there will no longer by any contact between the die and the IHS. Too thick, and you now have the mounting force of the heatsink going directly to the die (due to it being rigidly coupled to the underside of the IHS) rather than being carried through the IHS mounting to the edge of the substrate.
