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Good point with the warping / flex:

• to counter warping under “warm“ temperatures i recommend wall-thickness of 1.2mm or higher
• the parts near thermal heatpoints like radiators or motherboard have at least 6 mm Part-thickness
  • so warping will be rather unlikely
• as for material recommendations:
  • ASA has a high thermal stability until 90 C, guarantees a prolonged use of the case-parts
    • expected lifespan +8 years
    • on the note of ease of Print: it sucks!
  • PLA suffices in terms of thermal stability as Radiators mostly don’t reach temperatures higher than 60 C
    • on the note of Filament-quality, pls mind the cheaper ones and go for suppliers that offer datasheets of material properties, where thermal resistance is higher than 45C
    • expected lifespan +5 years (without constant UV stress; e.g. Sun)
  • PLA will warp after extensive Hardware usage, resulting in warped parts
    • negative case pressure recommended
    • use at your own discretion
    • expected lifespan +2 months