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While this is true, its biggest advantage is better temperatures and it requires less high case feets. But I aggree it is a valid point.Do you mean with design the outer look or the layout? The layout of the old C4 is also included in the new one. So with the optional window kit you can have sandwich + window kit also in the new C4. If you mean the outer design something like this could be also possible on the current C4 if the demand is high enough.I took some research about these 2.5" hot plug internal case carrier and it looks like you need ~ 25mm between PSU and front plate. Is this true?
While this is true, its biggest advantage is better temperatures and it requires less high case feets. But I aggree it is a valid point.
Do you mean with design the outer look or the layout? The layout of the old C4 is also included in the new one. So with the optional window kit you can have sandwich + window kit also in the new C4. If you mean the outer design something like this could be also possible on the current C4 if the demand is high enough.
I took some research about these 2.5" hot plug internal case carrier and it looks like you need ~ 25mm between PSU and front plate. Is this true?
