Normal
To add more info at risk of confusing matters more, it's true you can't rely on just TDP and power usage to gauge how hard it is to cool.Intel and AMD differ on CPU die sizes, power density, layouts, hotspots and physical build of the entire chip which effects the efficiency of the heat spreader.I think Intel are somewhat easier to cool at the moment when comparing 14th gen to Zen 4 at the exact same wattage. I could be wrong though and that is going to depend on each chip.You also have the whole LGA 1700 heat spreader bending issue to contend with on Intel, which does hurt thermals, but at least is preventable.
To add more info at risk of confusing matters more, it's true you can't rely on just TDP and power usage to gauge how hard it is to cool.
Intel and AMD differ on CPU die sizes, power density, layouts, hotspots and physical build of the entire chip which effects the efficiency of the heat spreader.
I think Intel are somewhat easier to cool at the moment when comparing 14th gen to Zen 4 at the exact same wattage. I could be wrong though and that is going to depend on each chip.
You also have the whole LGA 1700 heat spreader bending issue to contend with on Intel, which does hurt thermals, but at least is preventable.
