Hey Guys,
As I've mentioned previously, I've been working on a case design for a while. I am currently going back and forth between a couple of venting/airflow patterns and was hoping people here could help me out a bit with deciding what will likely provide the best cooling. The current layout of components is essentially like that in the Firewolfy MI-6 and Hutzy XS with HDPlex 300 AC-DC directly under the GPU and DC-DC board directly under the motherboard. The power delivery components can be moved to accommodate airflow. Airflow options I am considering are as follows:
1.) Vented side panels like the S4 mini. Solid aluminum top, bottom and front panels and some ventilation at the back around the I/O. No case fans as GPU/CPU have direct access to airflow from the outside via side panels. ~1cm of space between side panel and CPU/GPU coolers assuming a 40mm CPU cooler like the L9i. AC-DC and DC-DC power components would need to cool passively although there is a significant amount of heat sinking onto the case itself for both of these components
2.) Vented front panel with intake fans, vented back panel, all other panels solid. Forced air moving across all components from front to back. The GPU and CPU would each have about 1cm of clearance to the side panels.
3.) Solid front panel with vented top and bottom panel moving air in a pattern like the Lone Industries L1 and solid side panels. Power components would move to inside of front panel and fans would either go at top or bottom with a view to moving air upwards to exhaust out the top of the case.
I'm open to any other suggestions as well regarding potential layouts. The overall width right now is 127mm and I'd ideally like to keep that dimension. The other dimensions are open for modification. Cheers for any advice people can offer on the matter.
As I've mentioned previously, I've been working on a case design for a while. I am currently going back and forth between a couple of venting/airflow patterns and was hoping people here could help me out a bit with deciding what will likely provide the best cooling. The current layout of components is essentially like that in the Firewolfy MI-6 and Hutzy XS with HDPlex 300 AC-DC directly under the GPU and DC-DC board directly under the motherboard. The power delivery components can be moved to accommodate airflow. Airflow options I am considering are as follows:
1.) Vented side panels like the S4 mini. Solid aluminum top, bottom and front panels and some ventilation at the back around the I/O. No case fans as GPU/CPU have direct access to airflow from the outside via side panels. ~1cm of space between side panel and CPU/GPU coolers assuming a 40mm CPU cooler like the L9i. AC-DC and DC-DC power components would need to cool passively although there is a significant amount of heat sinking onto the case itself for both of these components
2.) Vented front panel with intake fans, vented back panel, all other panels solid. Forced air moving across all components from front to back. The GPU and CPU would each have about 1cm of clearance to the side panels.
3.) Solid front panel with vented top and bottom panel moving air in a pattern like the Lone Industries L1 and solid side panels. Power components would move to inside of front panel and fans would either go at top or bottom with a view to moving air upwards to exhaust out the top of the case.
I'm open to any other suggestions as well regarding potential layouts. The overall width right now is 127mm and I'd ideally like to keep that dimension. The other dimensions are open for modification. Cheers for any advice people can offer on the matter.