Hey Guys, I delidded a Intel chip last year, removed thermal paste, put some different thermal paste and relidded it. Seemed to work fine and temps never went passed 70-80C when stressing.
That was in a dan case. I have another dan case and want to do the same thing with a new AMD chip in July. Do I need to put the heat spreader back on or can I just delid and put some better thermal liquid and have the cooling block sit right on top?
edit: I found my answer, AMD chips have a soldered heat spreader. So that means no deliding most likely.
That was in a dan case. I have another dan case and want to do the same thing with a new AMD chip in July. Do I need to put the heat spreader back on or can I just delid and put some better thermal liquid and have the cooling block sit right on top?
edit: I found my answer, AMD chips have a soldered heat spreader. So that means no deliding most likely.
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